Baidu, Samsung Electronics Announce Production of its Cloud-to-Edge AI Accelerator to Start Early 2020 – HPCwire

BEIJING AND SEOUL, South Korea, Dec. 18, 2019 Baidu, a leading Chinese-language Internet search provider, and Samsung Electronics, a world leader in advanced semiconductor technology, today announced that Baidus first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year.

Baidu KUNLUN chip is built on the companys advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsungs 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per second (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to infer three times faster than the conventional GPU/FPGA-accelerating model.

Leveraging the chips limit-pushing computing power and power efficiency, Baidu can effectively support a wide variety of functions including large-scale AI workloads, such as search ranking, speech recognition, image processing, natural language processing, autonomous driving, and deep learning platforms like PaddlePaddle.

Through the first foundry cooperation between the two companies, Baidu will provide advanced AI platforms for maximizing AI performance, and Samsung will expand its foundry business into high performance computing (HPC) chips that are designed for cloud and edge computing.

We are excited to lead the HPC industry together with Samsung Foundry, said OuYang Jian, Distinguished Architect of Baidu. Baidu KUNLUN is a very challenging project since it requires not only a high level of reliability and performance at the same time, but is also a compilation of the most advanced technologies in the semiconductor industry. Thanks to Samsungs state of the art process technologies and competent foundry services, we were able to meet and surpass our goal to offer superior AI user experience.

We are excited to start a new foundry service for Baidu using our 14nm process technology, said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. Baidu KUNLUN is an important milestone for Samsung Foundry as were expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.

As higher performance is required in diverse applications such as AI and HPC, chip integration technology is becoming more and more important. Samsungs I-Cube technology, which connects a logic chip and high bandwidth memory (HBM) 2 with an interposer, provides higher density/ bandwidth on minimum size by utilizing Samsungs differentiated solutions.

Compared to previous technology, these solutions maximize product performance with more than 50% improved power/signal integrity. It is anticipated that I-Cube technology will mark a new epoch in the heterogeneous computing market. Samsung is also developing more advanced packaging technologies, such as redistribution layers (RDL) interposer and 4x, 8x HBM integrated package.

About Samsung Electronics Co., Ltd.

Samsung Electronics inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom athttp://news.samsung.com.

About Baidu

Baidu, Inc. is the leading Chinese language Internet search provider. Baidu aims to make the complicated world simpler through technology. Baidus ADSs trade on the NASDAQ Global Select Market under the symbol BIDU. Currently, ten ADSs represent one Class A ordinary share.

Source: Samsung Electronics Co., Ltd.

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Baidu, Samsung Electronics Announce Production of its Cloud-to-Edge AI Accelerator to Start Early 2020 - HPCwire