Presentations and tutorials focus on increasing system performance

SAN JOSE, Calif. - Xilinx, Inc. (NASDAQ: XLNX) experts will highlight high-performance FPGA design techniques including 28Gbps backplane transceiver design, 3D stacked silicon package design, and comprehensive DDR4 signal-integrity analysis using high-performance UltraScale FPGA silicon and packaging at DesignCon 2014. Through a series of tutorials and paper presentations, Xilinx experts will share their insights for overcoming system-design challenges and increasing system performance. Learn more about Xilinx UltraScale multi-Gigabit transceivers, 3D stacked silicon, and advanced signal-integrity techniques at http://www.xilinx.com/products/technology/index.htm and by attending Xilinx presentations and tutorials at DesignCon 2014 January 28 - 31, 2014 at the Santa Clara Convention Center in Santa Clara, CA.

Xilinx Tutorials

Tuesday, January 28, 2014 at 9:00 am - 12:00 pm, Ballroom K

Hands-On Tutorial for Fixture Removal of 28Gbps Tx Measurements

- This tutorial will offer tips and advanced techniques for characterizing a 28Gbps transceiver. Leading experts will provide the opportunity for you to follow along with hands-on computer labs using the latest in software tools for measurement calibration and fixture characterization, simulated fixture channel verification and analysis, and synthesis with in-situ fixture de-embedding with measured data.

Tuesday, January 28, 2014 at 9:00 am - 12:00 pm, Ballroom E

High Density High Performance Package and 3D Interconnect Design

- This tutorial is targeted at design and technology enablement for high-density and high-performance heterogeneous multi-chip integration with 3D interconnects. Multi-chip integration is defined by a broad range of high density interconnect technologies including high density PoP type package, SiP, SoP, TSV, and interposer, and most distinguishingly, addressing interconnect density at silicon level.

Tuesday, January 28, 2014 at 1:30 pm - 4:30 pm, Ballroom G

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Xilinx Experts to Highlight High-Performance 7 Series and UltraScale FPGA Designs at DesignCon ...